Revolutionizing Connectivity: Kigen and TMC Drive eSIM Innovation for Customer Premise Equipment (CPE) Solutions

June 30, 2023
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Key Takeaways:

  • Kigen and TMC have collaborated to introduce a GSMA-certified consumer eSIM solution for affordable customer premise equipment (CPE) solutions, addressing the need for diverse 4G/5G CPE devices in bridging the “last mile” of connectivity.
  • The joint solution combines Kigen’s compact eSIM operating system (OS) and TMC’s THD89 series eSIM chipset to offer easy installation, efficient CPE management, and streamlined fleet management, enabling original equipment manufacturers (OEMs) to drive innovation and meet the demand for affordable connectivity.
  • CPE devices play a critical role in the global deployment of 5G networks and are essential for ensuring a great return on the 5G investment.
  • The collaboration between Kigen and TMC aims to enhance the 5G broadband adoption, scalability, and ROI for stakeholders in the price-sensitive segment.
  • The joint solution is currently being sampled with customers addressing retail point of sale (POS), smart metering, and logistics eSIM applications.

About Kigen: Integrating Security for Better Lives

Kigen is a global leader in eSIM (eUICC) technology, empowering connected products and data with enhanced security. The company’s industry-leading SIM OS products have enabled over 2 billion SIMs worldwide, and their GSMA-certified remote SIM provisioning and eSIM services have positioned them as a key player in the eSIM enablement landscape. As an Arm-founded company, Kigen adopts an ecosystem approach to drive innovation and collaboration in the industry.

For more information about Kigen’s cutting-edge eSIM solutions and their vision for the #futureofSIM, visit their official website: Kigen

About TMC: Leading Semiconductor Solution Provider

Tongxin Microelectronics Co., Ltd. (TMC) is one of the principal enterprises of the Tsinghua Group, specializing in automotive electronics and smart chips. TMC’s business areas cover a wide range of domains, including smart cards, consumer electronics, automotive electronics, MCU, memory, and devices. With a focus on chip R&D technology and wafer testing capabilities, TMC has garnered numerous awards and certifications, positioning itself as an industry-leading semiconductor solution provider.

To learn more about TMC and their comprehensive semiconductor solutions, visit their official website: TMC

Revolutionizing Connectivity with Consumer eSIM Solution

Kigen and TMC have joined forces to introduce a groundbreaking GSMA-certified consumer eSIM solution for affordable customer premise equipment (CPE) solutions. CPE devices play a crucial role in delivering 5G networks to businesses and households that lack connectivity or have networks in motion. These devices bridge the “last mile” and are vital for achieving seamless connectivity.

Driven by the demand for diverse CPE form factors, including indoor, rooftop, wall-mounted, portable, and battery-operated devices, the joint solution offered by Kigen and TMC addresses the need for greater connectivity options. The advent of 5G Fixed Wireless Access (FWA) has already reached populous countries like India, Mexico, Nigeria, the Philippines, and South Africa, with global revenues projected to exceed $100 billion between 2020 and 2030.

Enhancing Connectivity with Compact eSIM OS and Robust eSIM Chipset

The joint solution by Kigen and TMC is built upon Kigen’s Consumer eSIM OS, known for its compact size and high efficiency, and TMC’s THD89 series eSIM chipset. The eSIM OS is the world’s most compact, allowing for seamless integration into CPE devices. TMC’s eSIM chipset, available in a smaller WLCSP package, provides robust security and reliable performance.

The collaboration between Kigen and TMC enables three key advantages for OEMs and end-users:

  1. Easy Installation: The joint solution simplifies the field setup workflow, enabling seamless onboarding of new devices. With an accompanying app, users can easily download profiles for activation or switching, eliminating the need for physical SIM cards.
  2. Efficient CPE Management: IT or administrative professionals can benefit from digital profile downloads, enhancing the management of CPE devices. This streamlined process improves the user experience and enables swift profile changes for different applications or networks.
  3. Driving Innovation: OEMs can focus on delivering value-added services and enhancing the user experience by leveraging the streamlined fleet management capabilities of the joint solution. This opens up opportunities for innovative applications and services.

Future Applications and Availability

The joint solution by Kigen and TMC is currently being sampled with customers in various industries, including retail point of sale, smart metering, and logistics eSIM applications. It enables these businesses to leverage the benefits of eSIM technology, such as simplified connectivity and enhanced management of CPE devices.

Interested original equipment manufacturers (OEMs) can learn more about the joint solution during MWC Shanghai 2023, which will take place from June 28 to June 30, 2023.

About Kigen

Kigen is a leading global provider of eSIM (eUICC) technology, enabling digital transformation across connected products and data. The company’s SIM OS products have enabled over 2 billion SIMs worldwide. Kigen’s remote SIM provisioning and eSIM services have been GSMA-certified, positioning the company as a global leader in eSIM enablement. As an Arm-founded company, Kigen adopts an ecosystem approach to drive innovation and collaboration in the industry.

For more information about Kigen and its future-focused SIM solutions, visit their official website: Kigen

About TMC

Tongxin Microelectronics Co., Ltd. (TMC) is an industry-leading semiconductor solution provider and part of the Tsinghua Group. With a strong focus on automotive electronics and smart chips, TMC’s business spans various sectors, including smart cards, consumer electronics, automotive electronics, MCU, memory, and devices. The company has a proven track record in chip R&D technology and wafer testing capabilities, earning numerous awards and certifications for its achievements in the semiconductor industry.

For more information about TMC and its semiconductor solutions, visit their official website: TMC

Conclusion

The collaboration between Kigen and TMC represents a significant advancement in eSIM technology for customer premise equipment (CPE) solutions. By combining Kigen’s compact eSIM OS and TMC’s eSIM chipset expertise, the joint solution offers OEMs an affordable and efficient way to provide connectivity for diverse 4G/5G CPE devices. This collaboration is crucial for driving the adoption of 5G Fixed Wireless Access (FWA) in areas with limited network infrastructure, bringing connectivity to businesses and households around the world.

To stay updated with Kigen’s eSIM innovations and industry insights, visit their official website or connect with them on LinkedIn to join discussions about the #futureofSIM.

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